PRODUCTS

We hold the top market share worldwide
in springs for OIS for smartphone.

The micro-metal-socket is best solution for multiple pins (>1000pins) semiconductor test.

Our test contact pin achieved higher conductivity,
low resistance...

Ninja, semi-custom type test socket
reduce your electrical testing time....

Metal masks that are used for electronic components
and semiconductors...

UPT offers new Shim Spacers solution which is the ring shim spacer for the optical instruments.

By diffusion bonding photo-etched metal plates,
we create high precision carrier...

Thermal solution is one of the urgent issues for
electronic components and...

To purify air, gas, water and other liquid materials
burr-free high aspect meshes and filters...

The appearance of this heat sink is very simple, but it is very complex air and liquid pathways inside the Heat Sink developed by combination of photo etching and diffusion bonding technology owned by UPT.

It helps cost down for final test and reduce the maintenance process.

UPT offers the entire process from the prototype stage (Small volume)of the filter to mass production(High volume).